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- 2004108489 alternative "HDP '04".
- 2004108489 alternative "High density microsystem design and packaging and component failure analysis".
- 2004108489 alternative "Proceedings, the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)".
- 2004108489 contributor B9879602.
- 2004108489 contributor B9879603.
- 2004108489 created "c2004.".
- 2004108489 date "2004".
- 2004108489 date "c2004.".
- 2004108489 dateCopyrighted "c2004.".
- 2004108489 description "Includes bibliographical references and author index.".
- 2004108489 extent "393 p. :".
- 2004108489 identifier "0780386205 (softbound ed.)".
- 2004108489 identifier "0780386213 (CD-ROM ed.)".
- 2004108489 identifier opac?punumber=9340.
- 2004108489 identifier 2004108489.html.
- 2004108489 issued "2004".
- 2004108489 issued "c2004.".
- 2004108489 language "eng".
- 2004108489 publisher "Piscataway, N.J. : IEEE,".
- 2004108489 subject "621.3815 22".
- 2004108489 subject "Electronic packaging Congresses.".
- 2004108489 subject "Integrated circuits Design and construction Congresses.".
- 2004108489 subject "Microelectromechanical systems Congresses.".
- 2004108489 subject "TK7874 .I3227 2004".
- 2004108489 title "HDP '04".
- 2004108489 title "High density microsystem design and packaging and component failure analysis".
- 2004108489 title "Proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) : June 30-July 3, 2004, Bao Long Hotel, Shanghai, China / organized by IEEE, IEEE CPMT ... [et al.].".
- 2004108489 title "Proceedings, the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)".
- 2004108489 type "text".