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- 2004116273 alternative "Stress induced phenomena in metallization".
- 2004116273 contributor B9885897.
- 2004116273 contributor B9885898.
- 2004116273 created "2004.".
- 2004116273 date "2004".
- 2004116273 date "2004.".
- 2004116273 dateCopyrighted "2004.".
- 2004116273 description "Fracture and reliability for low k dielectrics -- Electromigration -- Thermal stresses and void formation.".
- 2004116273 description "Includes bibliographical references and indexes.".
- 2004116273 extent "vii, 272 p. :".
- 2004116273 hasFormat "Also available via the World Wide Web.".
- 2004116273 identifier "0735402256".
- 2004116273 identifier 741.jsp.
- 2004116273 identifier 2004116273-d.html.
- 2004116273 isFormatOf "Also available via the World Wide Web.".
- 2004116273 isPartOf "AIP conference proceedings ; no. 741.".
- 2004116273 isPartOf "AIP conference proceedings, 0094-243X ; v. 741".
- 2004116273 issued "2004".
- 2004116273 issued "2004.".
- 2004116273 language "eng".
- 2004116273 publisher "Melville, N.Y. : American Institute of Physics,".
- 2004116273 relation "Also available via the World Wide Web.".
- 2004116273 subject "621.3815/2 22".
- 2004116273 subject "Copper Electric properties Congresses.".
- 2004116273 subject "Damascening Congresses.".
- 2004116273 subject "Dielectric films Defects Congresses.".
- 2004116273 subject "Electrodiffusion Congresses.".
- 2004116273 subject "Integrated circuits Defects Congresses.".
- 2004116273 subject "Interconnects (Integrated circuit technology) Defects Congresses.".
- 2004116273 subject "Metallic films Defects Congresses.".
- 2004116273 subject "Metallizing Congresses.".
- 2004116273 subject "Semiconductors Defects Congresses.".
- 2004116273 subject "TK7871.85 .I58445 2004".
- 2004116273 subject "Thin film devices Defects Congresses.".
- 2004116273 tableOfContents "Fracture and reliability for low k dielectrics -- Electromigration -- Thermal stresses and void formation.".
- 2004116273 title "Stress induced phenomena in metallization".
- 2004116273 title "Stress-induced phenomena in metallization : Seventh International Workshop on Stress-Induced Phenomena in Metallization, Austin, Texas, 14-16 June 2004 / editors, Paul S. Ho ... [et al.].".
- 2004116273 type "text".