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- 2004300845 contributor B9910066.
- 2004300845 created "c2004.".
- 2004300845 date "2004".
- 2004300845 date "c2004.".
- 2004300845 dateCopyrighted "c2004.".
- 2004300845 description "Includes bibliographical references and index.".
- 2004300845 extent "xi, 1026 p. :".
- 2004300845 identifier "0824748700".
- 2004300845 identifier es0711_3692.html.
- 2004300845 identifier 2004300845-d.html.
- 2004300845 isPartOf "Mechanical engineering (Marcel Dekker, Inc.) ; 170.".
- 2004300845 isPartOf "Mechanical engineering ; 170".
- 2004300845 issued "2004".
- 2004300845 issued "c2004.".
- 2004300845 language "eng".
- 2004300845 publisher "New York : Marcel Dekker,".
- 2004300845 subject "621.381 22".
- 2004300845 subject "Electronic packaging.".
- 2004300845 subject "Environmental protection.".
- 2004300845 subject "Green electronics.".
- 2004300845 subject "Lead-free electronics manufacturing processes.".
- 2004300845 subject "Microelectronics.".
- 2004300845 subject "Solder and soldering.".
- 2004300845 subject "TK7870.15 .H3657 2004".
- 2004300845 title "Handbook of lead-free solder technology for microelectronic assemblies / edited by Karl J. Puttlitz, Kathleen A. Stalter.".
- 2004300845 type "text".