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- 2005280238 contributor B10182860.
- 2005280238 contributor B10182861.
- 2005280238 contributor B10182862.
- 2005280238 created "c2005.".
- 2005280238 date "2005".
- 2005280238 date "c2005.".
- 2005280238 dateCopyrighted "c2005.".
- 2005280238 description "Includes bibliographical references and indexes.".
- 2005280238 extent "xi, 270 p. :".
- 2005280238 identifier "1558997814".
- 2005280238 isPartOf "Materials Research Society symposia proceedings ; v. 833.".
- 2005280238 isPartOf "Materials Research Society symposium proceedings ; v. 833".
- 2005280238 issued "2005".
- 2005280238 issued "c2005.".
- 2005280238 language "eng".
- 2005280238 publisher "Warrendale, Pa. : Materials Research Society,".
- 2005280238 subject "621.381/046 22".
- 2005280238 subject "Electronic packaging Materials Congresses.".
- 2005280238 subject "TK7870.15 .M384 2005".
- 2005280238 title "Materials, integration and packaging issues for high-frequency devices II : symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A. / editors: Yong S. Cho ... [et al.].".
- 2005280238 type "text".