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- 2005295019 contributor B10188486.
- 2005295019 created "c2004.".
- 2005295019 date "2004".
- 2005295019 date "c2004.".
- 2005295019 dateCopyrighted "c2004.".
- 2005295019 description "Introduction -- Failure analysis process flow -- Failure verification -- Failure mode: failure classifications -- Special devices -- Non-destructive analysis techniques -- Depackaging -- Photon emission (electroluminescence) localization techniques -- Microthermography -- Laser and particle beam-based localization techniques -- Deprocessing -- General imaging techniques -- Local deprocessing and imaging -- Materials analysis techniques -- Important topics for semiconductor devices -- FA techniques/tools roadmaps -- FA operation and management -- Appendix.".
- 2005295019 description "System requirements for accompanying CD-ROM: Windows 95/98/NT/ME/2000/XP ; Macintosh 8/9/Classic.".
- 2005295019 extent "xiv, 800 p. :".
- 2005295019 identifier "0871708043".
- 2005295019 issued "2004".
- 2005295019 issued "c2004.".
- 2005295019 language "eng".
- 2005295019 publisher "Materials Park, Ohio : ASM International,".
- 2005295019 requires "System requirements for accompanying CD-ROM: Windows 95/98/NT/ME/2000/XP ; Macintosh 8/9/Classic.".
- 2005295019 subject "Electronic apparatus and appliances Testing Handbooks, manuals, etc.".
- 2005295019 subject "Electronics Materials Testing Handbooks, manuals, etc.".
- 2005295019 subject "Microelectronics Materials Defects Handbooks, manuals, etc.".
- 2005295019 subject "Microelectronics Materials Testing Handbooks, manuals, etc.".
- 2005295019 subject "Semiconductors Defects Handbooks, manuals, etc.".
- 2005295019 subject "TK7871 .M52 2004".
- 2005295019 tableOfContents "Introduction -- Failure analysis process flow -- Failure verification -- Failure mode: failure classifications -- Special devices -- Non-destructive analysis techniques -- Depackaging -- Photon emission (electroluminescence) localization techniques -- Microthermography -- Laser and particle beam-based localization techniques -- Deprocessing -- General imaging techniques -- Local deprocessing and imaging -- Materials analysis techniques -- Important topics for semiconductor devices -- FA techniques/tools roadmaps -- FA operation and management -- Appendix.".
- 2005295019 title "Microelectronics failure analysis : desk reference / edited by The Electronic Device Failure Analysis Society, Desk Reference Committee.".
- 2005295019 type "text".