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- 2005295737 contributor B10189348.
- 2005295737 contributor B10189349.
- 2005295737 created "c2004.".
- 2005295737 date "2004".
- 2005295737 date "c2004.".
- 2005295737 dateCopyrighted "c2004.".
- 2005295737 description "Includes bibliographical references and author index.".
- 2005295737 extent "ix, 586 p. :".
- 2005295737 identifier "0791847071".
- 2005295737 isPartOf "EPP (Series) ; v. 4.".
- 2005295737 isPartOf "EPP ; vol. 4".
- 2005295737 issued "2004".
- 2005295737 issued "c2004.".
- 2005295737 language "eng".
- 2005295737 publisher "New York, N.Y. : ASME,".
- 2005295737 subject "621.381/046 22".
- 2005295737 subject "Electronic packaging Congresses.".
- 2005295737 subject "Integrated circuits Wafer-scale integration Congresses.".
- 2005295737 subject "Microelectromechanical systems Congresses.".
- 2005295737 subject "Microelectronic packaging Congresses.".
- 2005295737 subject "Nanotechnology Congresses.".
- 2005295737 subject "Photonics Congresses.".
- 2005295737 subject "Surface mount technology Congresses.".
- 2005295737 subject "TK7870.15 .E393 2004".
- 2005295737 title "Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology : presented at 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California, USA / sponsored by the Electronic and Photonic Packaging Division, ASME.".
- 2005295737 type "text".