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- 2005297971 contributor B10191805.
- 2005297971 contributor B10191806.
- 2005297971 contributor B10191807.
- 2005297971 created "c2003.".
- 2005297971 date "2003".
- 2005297971 date "c2003.".
- 2005297971 dateCopyrighted "c2003.".
- 2005297971 description "Includes bibliographical references and index.".
- 2005297971 extent "xi, 893 p. :".
- 2005297971 identifier "0791837149".
- 2005297971 isPartOf "EPP (Series) ; v. 3.".
- 2005297971 isPartOf "EPP ; vol. 3".
- 2005297971 issued "2003".
- 2005297971 issued "c2003.".
- 2005297971 language "eng".
- 2005297971 publisher "New York, N.Y. : American Society of Mechanical Engineers,".
- 2005297971 subject "Electronic packaging Congresses.".
- 2005297971 subject "Integrated circuits Wafer-scale integration Congresses.".
- 2005297971 subject "Microelectromechanical systems Congresses.".
- 2005297971 subject "Microelectronic packaging Congresses.".
- 2005297971 subject "Nanotechnology Congresses.".
- 2005297971 subject "Photonics Congresses.".
- 2005297971 subject "Surface mount technology Congresses.".
- 2005297971 subject "TK7870.15 .E392 2003".
- 2005297971 title "Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C. / sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.].".
- 2005297971 type "text".