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- 2006296236 contributor B10495064.
- 2006296236 contributor B10495065.
- 2006296236 created "c2005.".
- 2006296236 date "2005".
- 2006296236 date "c2005.".
- 2006296236 dateCopyrighted "c2005.".
- 2006296236 description "Includes bibliographical references and author index.".
- 2006296236 extent "xviii, 606 p. :".
- 2006296236 identifier "0791842177".
- 2006296236 isPartOf "EPP (Series) ; v. 5.".
- 2006296236 isPartOf "EPP ; vol. 5".
- 2006296236 issued "2005".
- 2006296236 issued "c2005.".
- 2006296236 language "eng".
- 2006296236 publisher "New York, N.Y. : ASME,".
- 2006296236 subject "621.381/046 22".
- 2006296236 subject "Electronic packaging Congresses.".
- 2006296236 subject "Integrated circuits Wafer-scale integration Congresses.".
- 2006296236 subject "Microelectromechanical systems Congresses.".
- 2006296236 subject "Microelectronic packaging Congresses.".
- 2006296236 subject "Nanotechnology Congresses.".
- 2006296236 subject "Photonics Congresses.".
- 2006296236 subject "Surface mount technology Congresses.".
- 2006296236 subject "TK7870.15 .E394 2005".
- 2006296236 title "Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA / sponsored by the Electronic and Photonic Packaging Division, ASME.".
- 2006296236 type "text".