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- 2006620707 contributor B10729589.
- 2006620707 created "c2004.".
- 2006620707 date "2004".
- 2006620707 date "c2004.".
- 2006620707 dateCopyrighted "c2004.".
- 2006620707 extent "x, 157 p. :".
- 2006620707 issued "2004".
- 2006620707 issued "c2004.".
- 2006620707 language "eng".
- 2006620707 publisher "Austin, Texas : TechSearch International,".
- 2006620707 subject "MLCM 2006/07327 (H)".
- 2006620707 title "Flip chip and wafer level packaging trends and market forecasts.".
- 2006620707 type "text".