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- 2006926703 alternative "2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06)".
- 2006926703 alternative "Proceedings, HDP '06".
- 2006926703 contributor B10738369.
- 2006926703 contributor B10738370.
- 2006926703 created "2006.".
- 2006926703 date "2006".
- 2006926703 date "2006.".
- 2006926703 dateCopyrighted "2006.".
- 2006926703 description "Includes bibliographical references and index.".
- 2006926703 extent "328 p. :".
- 2006926703 identifier "1424404886 (softbound ed.)".
- 2006926703 identifier "1424404894 (CD-ROM ed.)".
- 2006926703 identifier 2006926703.html.
- 2006926703 issued "2006".
- 2006926703 issued "2006.".
- 2006926703 language "eng".
- 2006926703 publisher "Piscataway, NJ : IEEE,".
- 2006926703 subject "621.3815 22".
- 2006926703 subject "Electronic packaging Congresses.".
- 2006926703 subject "Integrated circuits Design and construction Congresses.".
- 2006926703 subject "Microelectromechanical systems Congresses.".
- 2006926703 subject "TK7874 .I3227 2006".
- 2006926703 title "2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06)".
- 2006926703 title "Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06) : June 27th-June 30 2006 : Shanghai University, Shanghai, China / organized by IEEE ... [et al.].".
- 2006926703 title "Proceedings, HDP '06".
- 2006926703 type "text".