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- 2007272221 contributor B10816657.
- 2007272221 contributor B10816658.
- 2007272221 contributor B10816656.
- 2007272221 created "c2006.".
- 2007272221 date "2006".
- 2007272221 date "c2006.".
- 2007272221 dateCopyrighted "c2006.".
- 2007272221 description "Includes bibliographical references and indexes.".
- 2007272221 extent "xvii, 462 p. :".
- 2007272221 isPartOf "Materials Research Society symposia proceedings ; v. 914.".
- 2007272221 isPartOf "Materials Research Society symposium proceedings ; v. 914".
- 2007272221 issued "2006".
- 2007272221 issued "c2006.".
- 2007272221 language "eng".
- 2007272221 publisher "Warrendale, Pa. : Materials Research Society,".
- 2007272221 subject "621.3815/2 22".
- 2007272221 subject "Dielectric films Congresses.".
- 2007272221 subject "Integrated circuits Materials Congresses.".
- 2007272221 subject "Integrated circuits Reliability Congresses.".
- 2007272221 subject "Semiconductors Junctions Congresses.".
- 2007272221 subject "Semiconductors Materials Congresses.".
- 2007272221 subject "TK7871.85 .S9534395 2006".
- 2007272221 title "Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. / editors, Ting Y. Tsui ... [et al.].".
- 2007272221 type "text".