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- 2007275077 contributor B10820167.
- 2007275077 created "c2005.".
- 2007275077 date "2005".
- 2007275077 date "c2005.".
- 2007275077 dateCopyrighted "c2005.".
- 2007275077 description "Includes bibliographical references.".
- 2007275077 extent "viii, 150 p. :".
- 2007275077 issued "2005".
- 2007275077 issued "c2005.".
- 2007275077 language "eng".
- 2007275077 publisher "Austin, Tex. : TechSearch International,".
- 2007275077 subject "Multichip modules (Microelectronics) Design and construction.".
- 2007275077 subject "TK7870.15 .S97 2005".
- 2007275077 title "System-in-package : the new wave in 3D packaging.".
- 2007275077 type "text".