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- 2007277053 alternative "Simiconductor wafer bonding nine".
- 2007277053 contributor B10822637.
- 2007277053 contributor B10822638.
- 2007277053 contributor B10822639.
- 2007277053 created "c2006.".
- 2007277053 date "2006".
- 2007277053 date "c2006.".
- 2007277053 dateCopyrighted "c2006.".
- 2007277053 description "Includes bibliographical references and index.".
- 2007277053 extent "viii, 386 p. :".
- 2007277053 identifier "156677506X".
- 2007277053 isPartOf "ECS transactions ; vol.3, no.6".
- 2007277053 issued "2006".
- 2007277053 issued "c2006.".
- 2007277053 language "eng".
- 2007277053 publisher "Pennington, N.J. : The Electrochemical Society,".
- 2007277053 subject "Microelectromechanical systems Design and construction Congresses.".
- 2007277053 subject "Semiconductor wafers Congresses.".
- 2007277053 subject "Semiconductors Bonding Congresses.".
- 2007277053 subject "TK7871.85 I5838 2006".
- 2007277053 title "Simiconductor wafer bonding 9 : science, technology, and applications. / editors, H. Baumgart ... [et al.].".
- 2007277053 title "Simiconductor wafer bonding nine".
- 2007277053 type "text".