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- 2008008583 contributor B11081177.
- 2008008583 created "c2009.".
- 2008008583 date "2009".
- 2008008583 date "c2009.".
- 2008008583 dateCopyrighted "c2009.".
- 2008008583 description "Includes bibliographical references (p. [81]-94) and index.".
- 2008008583 extent "102 p. :".
- 2008008583 identifier "1604564512 (hardcover)".
- 2008008583 identifier "9781604564518 (hardcover)".
- 2008008583 identifier 2008008583.html.
- 2008008583 issued "2009".
- 2008008583 issued "c2009.".
- 2008008583 language "eng".
- 2008008583 publisher "New York : Nova Science Publishers,".
- 2008008583 subject "621.3815 22".
- 2008008583 subject "Electrodiffusion.".
- 2008008583 subject "Integrated circuits.".
- 2008008583 subject "Interconnects (Integrated circuit technology)".
- 2008008583 subject "TK7874.53 .H83 2009".
- 2008008583 title "Advanced Ta-based diffusion barriers for Cu interconnects / René Hübner.".
- 2008008583 type "text".