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- 2009352356 alternative "Chemical mechanical polishing".
- 2009352356 contributor B11523253.
- 2009352356 created "Heisei 20 [2008]".
- 2009352356 date "2008".
- 2009352356 date "Heisei 20 [2008]".
- 2009352356 dateCopyrighted "Heisei 20 [2008]".
- 2009352356 description "Includes bibliographical references (p. 253) and index.".
- 2009352356 extent "vii, 262 p. :".
- 2009352356 identifier "4274206122".
- 2009352356 identifier "9784274206122".
- 2009352356 issued "2008".
- 2009352356 issued "Heisei 20 [2008]".
- 2009352356 language "Entry words also in English; index in English with Japanese.".
- 2009352356 language "jpn eng".
- 2009352356 language "jpn".
- 2009352356 publisher "Tōkyō : Ōmusha,".
- 2009352356 subject "Chemical mechanical planarization Dictionaries Japanese.".
- 2009352356 subject "Grinding and polishing Dictionaries Japanese.".
- 2009352356 subject "Semiconductors Dictionaries Japanese.".
- 2009352356 subject "TK7871.84 .H36 2008".
- 2009352356 title "880-01 Handōtai CMP yōgo jiten / Seimitsu Kōgakkai Puranarizēshon CMP to Sono Ōyō Gijutsu Senmon Iinkai hen.".
- 2009352356 title "Chemical mechanical polishing".
- 2009352356 type "text".