Matches in Library of Congress for { <http://lccn.loc.gov/2009417219> ?p ?o. }
Showing items 1 to 27 of
27
with 100 items per page.
- 2009417219 created "2007.".
- 2009417219 date "2007".
- 2009417219 date "2007.".
- 2009417219 dateCopyrighted "2007.".
- 2009417219 description "Includes bibliographical references and index.".
- 2009417219 description "Part 1/ SINGLE- POINT MACHINING PROCESSES: Surface and subsurface integrity in ductile machining of semiconductor materials/ Jiwang Yan -- Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics / John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh -- Ductile machining and high pressure phase transformations of semiconductor crystals / Renato Goulart Jasinevicius, Jaime Gilberto Duduch and Paulo Sergio Pizani.".
- 2009417219 description "Part 2/ CHARACTERIZATION OF DEFORMATION MECHANISMS: Microstructural cahnges in silicon caused by indentation and machining / L. C. Zhang -- MD simulation of semiconductor micromachining / Hiroaki Tanaka and Shoichi Shimada.".
- 2009417219 description "Part 3/ ABRASIVE MACHINING PROCESSES: Grinding of silicon wafers in the nano-technology era / Z.J. Pei, Z. C. Li and G. R. Fisher -- Single-crystalline and poly-crystalline silicon wafer production using slurry wire for wafer slicing with micro-and nano-scale rolling-indenting / Sumeet Bhagavat and Imin Kao -- Tribo-metrology of CMP / Norm V. Gitts".
- 2009417219 description "Part 4/ HYBRID AND LASER MACHINING: Semiconductor nanofabrication by combining nanoscale machining with wet etching / Noboiru Morita and Noritaka Kawasegi -- Laser machining of semiconductor devices / Maher S. Amer.".
- 2009417219 extent "360 p. :".
- 2009417219 identifier "8178953013".
- 2009417219 identifier "9788178953014".
- 2009417219 issued "2007".
- 2009417219 issued "2007.".
- 2009417219 language "eng".
- 2009417219 publisher "Kerala, India : Transworld Research Network,".
- 2009417219 subject "621.3815/2 22".
- 2009417219 subject "Electronic industries.".
- 2009417219 subject "Semiconductors Design and construction.".
- 2009417219 subject "Semicondutores. larpcal".
- 2009417219 subject "TK7871.85 .S42934 2007".
- 2009417219 tableOfContents "Part 1/ SINGLE- POINT MACHINING PROCESSES: Surface and subsurface integrity in ductile machining of semiconductor materials/ Jiwang Yan -- Numerical simulations and cutting experiments on single point diamond machining of semiconductors and ceramics / John A. Patten, Jerry Jacob, Biswarup Bhattacharya, Andrew Grevstad, Ning Fang and Eric R. Marsh -- Ductile machining and high pressure phase transformations of semiconductor crystals / Renato Goulart Jasinevicius, Jaime Gilberto Duduch and Paulo Sergio Pizani.".
- 2009417219 tableOfContents "Part 2/ CHARACTERIZATION OF DEFORMATION MECHANISMS: Microstructural cahnges in silicon caused by indentation and machining / L. C. Zhang -- MD simulation of semiconductor micromachining / Hiroaki Tanaka and Shoichi Shimada.".
- 2009417219 tableOfContents "Part 3/ ABRASIVE MACHINING PROCESSES: Grinding of silicon wafers in the nano-technology era / Z.J. Pei, Z. C. Li and G. R. Fisher -- Single-crystalline and poly-crystalline silicon wafer production using slurry wire for wafer slicing with micro-and nano-scale rolling-indenting / Sumeet Bhagavat and Imin Kao -- Tribo-metrology of CMP / Norm V. Gitts".
- 2009417219 tableOfContents "Part 4/ HYBRID AND LASER MACHINING: Semiconductor nanofabrication by combining nanoscale machining with wet etching / Noboiru Morita and Noritaka Kawasegi -- Laser machining of semiconductor devices / Maher S. Amer.".
- 2009417219 title "Semiconductor machining at the micro-nano scale / edited by Jiwang Yan and John Patten.".
- 2009417219 type "text".