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- 2010040873 contributor B11785674.
- 2010040873 created "c2011.".
- 2010040873 date "2011".
- 2010040873 date "c2011.".
- 2010040873 dateCopyrighted "c2011.".
- 2010040873 description "Includes bibliographical references and index.".
- 2010040873 description "Machine generated contents note: Brief TOCCh 1. Introduction to RoHS Compliant Semiconductor and Packaging TechnologiesCh 2. Reliability Engineering of Lead-Free InterconnectsCh 3. Notes on Failure CriterionCh 4. Reliability of 1657-Pin CCGA Lead-Free Solder JointsCh 5. Reliability of PBGA (w/o Underfils) Lead-Free Solder JointsCh 6. Reliability of LED Lead-Free InterconnectsCh 7. Reliability of VCSEL Lead-Free InterconnectsCh 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder JointsCh 9. Reliability of Lead-Free (SACX) Solder JointsCh 10. Chip-to-Wafer (C2W) Lead-Free Interconnect ReliabilityCh 11. Wafer-to-Wafer (W2W) Lead-Free Interconnect ReliabilityCh 12. Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect ReliabilityCh 13. Electromigration of Lead-Free Microbumps for 3D IC IntegrationsCh 14. Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test ResultsCh 15. Effects of High Strain Rate (Impact) on SAC Solder BumpsCh 16. Effects of Voids on Solder Joints Reliability.".
- 2010040873 extent "xxix, 606 p. :".
- 2010040873 identifier "9780071753791 (hardback)".
- 2010040873 issued "2011".
- 2010040873 issued "c2011.".
- 2010040873 language "eng".
- 2010040873 publisher "New York, NY : McGraw-Hill Professional,".
- 2010040873 subject "621.381/046 22".
- 2010040873 subject "Green technology Reliability.".
- 2010040873 subject "Interconnects (Integrated circuit technology) Reliability.".
- 2010040873 subject "TECHNOLOGY & ENGINEERING / Electronics / Optoelectronics bisacsh.".
- 2010040873 subject "TK7874.53 .L38 2011".
- 2010040873 tableOfContents "Machine generated contents note: Brief TOCCh 1. Introduction to RoHS Compliant Semiconductor and Packaging TechnologiesCh 2. Reliability Engineering of Lead-Free InterconnectsCh 3. Notes on Failure CriterionCh 4. Reliability of 1657-Pin CCGA Lead-Free Solder JointsCh 5. Reliability of PBGA (w/o Underfils) Lead-Free Solder JointsCh 6. Reliability of LED Lead-Free InterconnectsCh 7. Reliability of VCSEL Lead-Free InterconnectsCh 8. Reliability of Low-Temperature Lead-Free (SnBiAg) Solder JointsCh 9. Reliability of Lead-Free (SACX) Solder JointsCh 10. Chip-to-Wafer (C2W) Lead-Free Interconnect ReliabilityCh 11. Wafer-to-Wafer (W2W) Lead-Free Interconnect ReliabilityCh 12. Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect ReliabilityCh 13. Electromigration of Lead-Free Microbumps for 3D IC IntegrationsCh 14. Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test ResultsCh 15. Effects of High Strain Rate (Impact) on SAC Solder BumpsCh 16. Effects of Voids on Solder Joints Reliability.".
- 2010040873 title "Reliability of RoHS-Compliant 2D and 3D IC interconnects / John Lau.".
- 2010040873 type "text".