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- 2010283517 alternative "Design for manufacturability through design-process integration four".
- 2010283517 contributor B11810872.
- 2010283517 contributor B11810873.
- 2010283517 created "c2010.".
- 2010283517 date "2010".
- 2010283517 date "c2010.".
- 2010283517 dateCopyrighted "c2010.".
- 2010283517 description "Includes bibliographical references and author index.".
- 2010283517 extent "1 v. (various pagings) :".
- 2010283517 identifier "9780819480552 (pbk.)".
- 2010283517 isPartOf "Proceedings of SPIE, 0277-786X ; v. 7641".
- 2010283517 issued "2010".
- 2010283517 issued "c2010.".
- 2010283517 language "eng".
- 2010283517 publisher "Bellingham, Wash. : SPIE,".
- 2010283517 subject "621.3815 23".
- 2010283517 subject "Integrated circuits Defects Analysis Congresses.".
- 2010283517 subject "Integrated circuits Design and construction Congresses.".
- 2010283517 subject "Microelectronics industry Quality control Congresses.".
- 2010283517 subject "Quality control Congresses.".
- 2010283517 subject "Semiconductor wafers Defects Analysis Congresses.".
- 2010283517 subject "Semiconductors Design and construction Congresses.".
- 2010283517 subject "TK7874 .D474978 2010".
- 2010283517 title "Design for manufacturability through design-process integration IV : 24-25 February 2010, San Jose, California, United States / Michael L. Rieger, Joerg Thiele, editors ; sponsored and published by SPIE ; cooperating organization, SEMATECH Inc. (United States).".
- 2010283517 title "Design for manufacturability through design-process integration four".
- 2010283517 type "text".