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- 2010287045 contributor B11814466.
- 2010287045 contributor B11814467.
- 2010287045 created "c2010.".
- 2010287045 date "2010".
- 2010287045 date "c2010.".
- 2010287045 dateCopyrighted "c2010.".
- 2010287045 extent "xx, 426 p. :".
- 2010287045 identifier "9780071476232".
- 2010287045 issued "2010".
- 2010287045 issued "c2010.".
- 2010287045 language "eng".
- 2010287045 publisher "New York : McGraw-Hill,".
- 2010287045 subject "Electronic packaging Defects.".
- 2010287045 subject "Electronic packaging Reliability.".
- 2010287045 subject "Semiconductors Failures.".
- 2010287045 subject "TK7836 .H366 2010".
- 2010287045 subject "Wire bonding (Electronic packaging) Production control.".
- 2010287045 title "Wire bonding in microelectronics / George G. Harmon.".
- 2010287045 type "text".