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- 2011016598 alternative "Three D IC stacking technology".
- 2011016598 contributor B12119160.
- 2011016598 created "2011.".
- 2011016598 date "2011".
- 2011016598 date "2011.".
- 2011016598 dateCopyrighted "2011.".
- 2011016598 description "Includes bibliographical references and index.".
- 2011016598 extent "xviii, 521 p. :".
- 2011016598 identifier "9780071741958 (hardback)".
- 2011016598 issued "2011".
- 2011016598 issued "2011.".
- 2011016598 language "eng".
- 2011016598 publisher "New York : McGraw-Hill Professional,".
- 2011016598 subject "621.3815/3 23".
- 2011016598 subject "Microelectronic packaging.".
- 2011016598 subject "TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh.".
- 2011016598 subject "TK7874.893 .A14 2011".
- 2011016598 subject "Three-dimensional integrated circuits.".
- 2011016598 title "3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors.".
- 2011016598 title "Three D IC stacking technology".
- 2011016598 type "text".