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- 2011019534 contributor B12122641.
- 2011019534 contributor B12122642.
- 2011019534 created "2011.".
- 2011019534 date "2011".
- 2011019534 date "2011.".
- 2011019534 dateCopyrighted "2011.".
- 2011019534 description "Includes bibliographical references and index.".
- 2011019534 extent "xxii, 564 p. :".
- 2011019534 identifier "0470827807 (hardback)".
- 2011019534 identifier "9780470827802 (hardback)".
- 2011019534 issued "2011".
- 2011019534 issued "2011.".
- 2011019534 language "eng".
- 2011019534 publisher "[Beijing] : Chemical Industry Press ; Singapore : Wiley,".
- 2011019534 subject "621.381/046 23".
- 2011019534 subject "Microelectronic packaging Simulation methods.".
- 2011019534 subject "TK7870.15 .L58 2011".
- 2011019534 title "Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing / Sheng Liu, Yong Liu.".
- 2011019534 type "text".