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- 2011293397 contributor B12181749.
- 2011293397 contributor B12181750.
- 2011293397 created "c2010.".
- 2011293397 date "2010".
- 2011293397 date "c2010.".
- 2011293397 dateCopyrighted "c2010.".
- 2011293397 description "Includes bibliographical references.".
- 2011293397 extent "1 v. (various pagings) :".
- 2011293397 identifier "0819479888 (pbk.)".
- 2011293397 identifier "9780819479884 (pbk.)".
- 2011293397 isPartOf "Proceedings of SPIE, 0277-786X ; v. 7592".
- 2011293397 isPartOf "Proceedings of SPIE--the International Society for Optical Engineering ; v. 7592.".
- 2011293397 issued "2010".
- 2011293397 issued "c2010.".
- 2011293397 language "eng".
- 2011293397 publisher "Bellingham, Wash. : SPIE,".
- 2011293397 subject "621.381 23".
- 2011293397 subject "Microelectromechanical systems Reliability Congresses.".
- 2011293397 subject "Microelectromechanical systems Testing Congresses.".
- 2011293397 subject "Microelectronic packaging Congresses.".
- 2011293397 subject "TK7875 .R438 2010".
- 2011293397 title "Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX : 25-26 January 2010, San Francisco, California, United States / Richard C. Kullberg, Rajeshuni Ramesham, editors ; sponsored and published by SPIE.".
- 2011293397 type "text".