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- 2011377399 contributor B12246389.
- 2011377399 created "c2011.".
- 2011377399 date "2011".
- 2011377399 date "c2011.".
- 2011377399 dateCopyrighted "c2011.".
- 2011377399 description "Includes bibliographical references and index.".
- 2011377399 description "Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.".
- 2011377399 extent "xxi, 616 p. :".
- 2011377399 identifier "1441977589 (hbk)".
- 2011377399 identifier "9781441977588 (hbk)".
- 2011377399 isPartOf "Springer series in advanced microelectronics ; 30.".
- 2011377399 isPartOf "Springer series in advanced microelectronics, 1437-0387 ; 30".
- 2011377399 issued "2011".
- 2011377399 issued "c2011.".
- 2011377399 language "eng".
- 2011377399 publisher "New York ; London : Springer,".
- 2011377399 subject "621.381 22".
- 2011377399 subject "Electronic apparatus and appliances Temperature control.".
- 2011377399 subject "Electronic packaging Materials.".
- 2011377399 subject "TK7870.15 .T56 2011".
- 2011377399 tableOfContents "Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.".
- 2011377399 title "Advanced materials for thermal management of electronic packaging / Xingcun Colin Tong.".
- 2011377399 type "text".