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- 2011909347 contributor B12412076.
- 2011909347 contributor B12412077.
- 2011909347 contributor B12412078.
- 2011909347 created "2011.".
- 2011909347 date "2011".
- 2011909347 date "2011.".
- 2011909347 dateCopyrighted "2011.".
- 2011909347 description "Includes bibliographical references and index.".
- 2011909347 description "White papers -- Multi-scale modeling -- Multi-scale materials parameters -- Multi-scale stress characterization -- TSV : process characterization and failure analysis.".
- 2011909347 extent "vi, 175 p. :".
- 2011909347 identifier "0735409382".
- 2011909347 identifier "9780735409385".
- 2011909347 identifier 2011909347-d.html.
- 2011909347 isPartOf "AIP conference proceedings ; no. 1378.".
- 2011909347 isPartOf "AIP conference proceedings, 0094-243X ; 1378".
- 2011909347 issued "2011".
- 2011909347 issued "2011.".
- 2011909347 language "eng".
- 2011909347 publisher "Melville, N.Y. : American Institute of Physics,".
- 2011909347 subject "Strains and stresses Measurement Congresses.".
- 2011909347 subject "Strains and stresses Simulation methods Congresses.".
- 2011909347 subject "Stress relaxation Simulation methods Congresses.".
- 2011909347 subject "TK7874.893 .I58 2010".
- 2011909347 subject "Three-dimensional integrated circuits Design and construction Congresses.".
- 2011909347 tableOfContents "White papers -- Multi-scale modeling -- Multi-scale materials parameters -- Multi-scale stress characterization -- TSV : process characterization and failure analysis.".
- 2011909347 title "Stress management for 3D ICs using through silicon vias : International Workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, U.S.A, March 16, 2010, San Francisco, CA, U.S.A., July 13, 2010, Dresden, Germany, October 20, 2010 / editors, Ehrenfried Zschech ... [et al].".
- 2011909347 type "text".