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- 73600343 contributor B2364439.
- 73600343 created "1974.".
- 73600343 date "1974".
- 73600343 date "1974.".
- 73600343 dateCopyrighted "1974.".
- 73600343 description "Includes bibliographical references.".
- 73600343 extent "vi, 102 p.".
- 73600343 isPartOf "NBS special publication 400-2. Semiconductor measurement technology".
- 73600343 isPartOf "NBS special publication ; 400-2.".
- 73600343 isPartOf "Semiconductor measurement technology.".
- 73600343 issued "1974".
- 73600343 issued "1974.".
- 73600343 language "eng".
- 73600343 publisher "[Washington] U.S. National Bureau of Standards; [for sale by the Supt. of Docs., U.S. Govt. Print. Off.]".
- 73600343 subject "389/.08 s 671".
- 73600343 subject "Microelectronics.".
- 73600343 subject "QC100 .U57 no. 400-2 TS228.92".
- 73600343 subject "Ultrasonic welding.".
- 73600343 title "Microelectronic ultrasonic bonding. George G. Harman, editor.".
- 73600343 type "text".