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- 81069015 contributor B3979529.
- 81069015 contributor B3979530.
- 81069015 created "c1981.".
- 81069015 date "1981".
- 81069015 date "c1981.".
- 81069015 dateCopyrighted "c1981.".
- 81069015 description "Includes bibliographical references.".
- 81069015 description "Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus -- Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow -- Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation / H. Birnbreier -- Evaluation of surface heat transfer coefficients for electronic module packages / M.L. Buller and R.F. Kilburn -- Cooling techniques and thermal analysis of circuit board mounted electronic equipment / C.J. Feldmanis -- Microelectronic device thermal resistance / R.J. Hannemann -- Predicting performance of forced air cooled heat sinks / F. Wenthen -- Boiling heat transfer of silicon integrated-circuit chips mounted on a substrate / U.P. Hwang and K.P. Moran -- Heat transfer performance of a heat pipe radiator for a 1,000 ampere thyristor with air cooling / M.D. Xin ... [et al.]".
- 81069015 extent "v, 64 p. :".
- 81069015 issued "1981".
- 81069015 issued "c1981.".
- 81069015 language "eng".
- 81069015 publisher "New York, N.Y. (345 E. 47th St., New York 10017) : ASME,".
- 81069015 subject "621.3815 19".
- 81069015 subject "Electronic apparatus and appliances Cooling Congresses.".
- 81069015 subject "Heat Transmission Congresses.".
- 81069015 subject "TK7870.25 .H4".
- 81069015 tableOfContents "Thermal considerations in the packaging of electrical and electronic components / A. Bar-Cohen and A. Kraus -- Thermally optimum spacing of vertical, natural convection cooled, parallel plates / A. Bar-Cohen and W.M. Rohsenow -- Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation / H. Birnbreier -- Evaluation of surface heat transfer coefficients for electronic module packages / M.L. Buller and R.F. Kilburn -- Cooling techniques and thermal analysis of circuit board mounted electronic equipment / C.J. Feldmanis -- Microelectronic device thermal resistance / R.J. Hannemann -- Predicting performance of forced air cooled heat sinks / F. Wenthen -- Boiling heat transfer of silicon integrated-circuit chips mounted on a substrate / U.P. Hwang and K.P. Moran -- Heat transfer performance of a heat pipe radiator for a 1,000 ampere thyristor with air cooling / M.D. Xin ... [et al.]".
- 81069015 title "Heat transfer in electronic equipment : presented at the winter annual meeting of the American Society of Mechanical Engineers, Washington, D.C., November 15-20, 1981 / sponsored by the K-12 Committee on Aircraft and Astronautical Heat Transfer, the Heat Transfer Division, ASME ; edited by Matthew D. Kelleher, M. Michael Yovanovich.".
- 81069015 type "text".