Matches in Library of Congress for { <http://lccn.loc.gov/89080612> ?p ?o. }
Showing items 1 to 22 of
22
with 100 items per page.
- 89080612 alternative "Micro electronic packaging technology.".
- 89080612 contributor B5901017.
- 89080612 contributor B5901018.
- 89080612 contributor B5901019.
- 89080612 created "c1989.".
- 89080612 date "1989".
- 89080612 date "c1989.".
- 89080612 dateCopyrighted "c1989.".
- 89080612 description "Includes bibliographies.".
- 89080612 extent "xii, 479 p. :".
- 89080612 identifier "0871703599".
- 89080612 issued "1989".
- 89080612 issued "c1989.".
- 89080612 language "eng".
- 89080612 publisher "Metals Park, Ohio : ASM International,".
- 89080612 subject "621.381/046 20".
- 89080612 subject "Microelectronic packaging Congresses.".
- 89080612 subject "Microelectronics Materials Congresses.".
- 89080612 subject "Surface mount technology Congresses.".
- 89080612 subject "TK7874 .A77 1989".
- 89080612 title "Microelectronic packaging technology : materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989 / edited by Wei T. Shieh ; sponsored by the Electronic Materials and Processing Division of ASM International.".
- 89080612 type "text".