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- 89081529 contributor B5901820.
- 89081529 contributor B5901821.
- 89081529 created "c1989.".
- 89081529 date "1989".
- 89081529 date "c1989.".
- 89081529 dateCopyrighted "c1989.".
- 89081529 description "Includes bibliographical references.".
- 89081529 extent "xiii, 202 p. :".
- 89081529 identifier "0930815254".
- 89081529 issued "1989".
- 89081529 issued "c1989.".
- 89081529 language "eng".
- 89081529 publisher "Reston, Va. : International Society for Hybrid Microelectronics,".
- 89081529 subject "621.381/5 20".
- 89081529 subject "Electronic packaging Defects.".
- 89081529 subject "Electronic packaging Reliability.".
- 89081529 subject "Semiconductors Failures.".
- 89081529 subject "TK7874 .H387 1989".
- 89081529 subject "Wire bonding (Electronic packaging) Production control.".
- 89081529 title "Reliability and yield problems of wire bonding in microelectronics : the application of materials and interface science / by George G. Harman.".
- 89081529 type "text".