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- 91058586 contributor B6407557.
- 91058586 contributor B6407558.
- 91058586 created "c1991.".
- 91058586 date "1991".
- 91058586 date "c1991.".
- 91058586 dateCopyrighted "c1991.".
- 91058586 description "Includes bibliographical references and index.".
- 91058586 extent "v, 153 p. :".
- 91058586 identifier "0791808963".
- 91058586 isPartOf "AMD (Series) ; v. 131.".
- 91058586 isPartOf "AMD ; vol. 131".
- 91058586 isPartOf "EEP (Series) ; vol. 1.".
- 91058586 isPartOf "EEP ; vol. 1".
- 91058586 issued "1991".
- 91058586 issued "c1991.".
- 91058586 language "eng".
- 91058586 publisher "New York, N.Y. : The Society,".
- 91058586 subject "621.381/046 20".
- 91058586 subject "Electronic packaging Congresses.".
- 91058586 subject "Microelectronic packaging Congresses.".
- 91058586 subject "TK7870.15 .M35 1991".
- 91058586 title "Manufacturing processes and materials challenges in microelectronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georgia, December 1-6, 1991 / sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by W.T. Chen, P. Engel, W.E. Jahsman.".
- 91058586 type "text".