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- 92043285 contributor B6661604.
- 92043285 created "c1993.".
- 92043285 date "1993".
- 92043285 date "c1993.".
- 92043285 dateCopyrighted "c1993.".
- 92043285 description "Includes bibliographical references and index.".
- 92043285 extent "xxii, 883 p. :".
- 92043285 identifier "0442010583".
- 92043285 issued "1993".
- 92043285 issued "c1993.".
- 92043285 language "eng".
- 92043285 publisher "New York : Van Nostrand Reinhold,".
- 92043285 subject "621.381/046 20".
- 92043285 subject "Electronic packaging.".
- 92043285 subject "Microelectronic packaging.".
- 92043285 subject "TK7870.15 .T48 1993".
- 92043285 subject "Thermal stresses.".
- 92043285 title "Thermal stress and strain in microelectronics packaging / edited by John H. Lau.".
- 92043285 type "text".