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- 92056567%2F%2Fr96 contributor B6671852.
- 92056567%2F%2Fr96 contributor B6671853.
- 92056567%2F%2Fr96 created "c1992.".
- 92056567%2F%2Fr96 date "1992".
- 92056567%2F%2Fr96 date "c1992.".
- 92056567%2F%2Fr96 dateCopyrighted "c1992.".
- 92056567%2F%2Fr96 description "Includes bibliographical references and index.".
- 92056567%2F%2Fr96 extent "v, 211 p. :".
- 92056567%2F%2Fr96 identifier "0791811123".
- 92056567%2F%2Fr96 isPartOf "EEP (Series) ; vol. 2.".
- 92056567%2F%2Fr96 isPartOf "EEP ; vol. 2".
- 92056567%2F%2Fr96 isPartOf "PED (Series) ; vol. 60.".
- 92056567%2F%2Fr96 isPartOf "PED ; vol. 60".
- 92056567%2F%2Fr96 issued "1992".
- 92056567%2F%2Fr96 issued "c1992.".
- 92056567%2F%2Fr96 language "eng".
- 92056567%2F%2Fr96 publisher "New York : The Society,".
- 92056567%2F%2Fr96 subject "621.381/046 20".
- 92056567%2F%2Fr96 subject "Electronic packaging Congresses.".
- 92056567%2F%2Fr96 subject "Manufacturing processes Congresses.".
- 92056567%2F%2Fr96 subject "TK7870.15 .M34 1992".
- 92056567%2F%2Fr96 title "Manufacturing aspects in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992 / sponsored by the Electrical and Electronic Packaging Division and the Production Engineering Division, ASME ; edited by Y.C. Lee, T.J. Bennett.".
- 92056567%2F%2Fr96 type "text".