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- 93007685 contributor B6898722.
- 93007685 created "c1993.".
- 93007685 date "1993".
- 93007685 date "c1993.".
- 93007685 dateCopyrighted "c1993.".
- 93007685 description "Includes bibliographical references and index.".
- 93007685 extent "xviii, 274 p. :".
- 93007685 identifier "0750692677".
- 93007685 isPartOf "Materials characterization series".
- 93007685 issued "1993".
- 93007685 issued "c1993.".
- 93007685 language "eng".
- 93007685 publisher "Boston : Butterworth-Heinemann,".
- 93007685 subject "621.381/046 20".
- 93007685 subject "Electronic packaging Materials.".
- 93007685 subject "Integrated circuits Design and construction.".
- 93007685 subject "TK7870.15 .C52 1993".
- 93007685 title "Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick.".
- 93007685 type "text".