Matches in Library of Congress for { <http://lccn.loc.gov/93009709> ?p ?o. }
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- 93009709 contributor B6901149.
- 93009709 created "c1994.".
- 93009709 date "1994".
- 93009709 date "c1994.".
- 93009709 dateCopyrighted "c1994.".
- 93009709 description "Includes bibliographical references (p. 419-450) and index.".
- 93009709 extent "xxxiii, 461 p. :".
- 93009709 identifier "0471594369 (alk. paper) :".
- 93009709 identifier 93009709.html.
- 93009709 identifier 93009709.html.
- 93009709 identifier 93009709.html.
- 93009709 issued "1994".
- 93009709 issued "c1994.".
- 93009709 language "eng".
- 93009709 publisher "New York : Wiley,".
- 93009709 subject "621.381/046 20".
- 93009709 subject "Electronic packaging Defects.".
- 93009709 subject "Electronic packaging Quality control.".
- 93009709 subject "Electronic packaging Testing.".
- 93009709 subject "Quality assurance.".
- 93009709 subject "TK7870.15 .Q35 1994".
- 93009709 title "Quality conformance and qualification of microelectronic packages and interconnects / edited by Michael Pecht ... [et al.].".
- 93009709 type "text".