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- 93070069 alternative "Interconnects, contact metallization, and multilevel metallization/reliability for semiconductor devices, interconnects, and thin insulator materials.".
- 93070069 contributor B6949305.
- 93070069 contributor B6949306.
- 93070069 contributor B6949307.
- 93070069 created "c1993.".
- 93070069 date "1993".
- 93070069 date "c1993.".
- 93070069 dateCopyrighted "c1993.".
- 93070069 description "Includes bibliographical references and indexes.".
- 93070069 extent "xiii, 494 p. :".
- 93070069 identifier "156677067X".
- 93070069 isPartOf "Proceedings (Electrochemical Society) ; v. 93-25.".
- 93070069 isPartOf "Proceedings ; v. 93-25".
- 93070069 issued "1993".
- 93070069 issued "c1993.".
- 93070069 language "eng".
- 93070069 publisher "Pennington, NJ : Electrochemical Society,".
- 93070069 subject "621.3815 20".
- 93070069 subject "Electronic packaging Congresses.".
- 93070069 subject "Metallizing Congresses.".
- 93070069 subject "Semiconductors Congresses.".
- 93070069 subject "TK7870.15 .P76 1993".
- 93070069 title "Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials / edited by T. O. Herndon ... [et al.].".
- 93070069 type "text".