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- 93070070 alternative "Semiconductor wafer bonding: science, technology, and applications.".
- 93070070 contributor B6949308.
- 93070070 contributor B6949309.
- 93070070 contributor B6949310.
- 93070070 created "c1993.".
- 93070070 date "1993".
- 93070070 date "c1993.".
- 93070070 dateCopyrighted "c1993.".
- 93070070 description "Includes bibliographical references and indexes.".
- 93070070 extent "x, 485 p. :".
- 93070070 identifier "1566770688".
- 93070070 isPartOf "Proceedings (Electrochemical Society) ; v. 93-29.".
- 93070070 isPartOf "Proceedings / Electrochemical Society ; v. 93-29".
- 93070070 issued "1993".
- 93070070 issued "c1993.".
- 93070070 language "eng".
- 93070070 publisher "Pennington, NJ : Electrochemical Society,".
- 93070070 subject "621.3815/2 20".
- 93070070 subject "Semiconductor wafers Congresses.".
- 93070070 subject "Semiconductors Bonding Congresses.".
- 93070070 subject "TK7871.85 .I5838 1993".
- 93070070 title "Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications / edited by Martin A. Schmidt ... [et al. ; sponsored by the] Electronics and Dielectric Science and Technology divisions.".
- 93070070 type "text".