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- 94079149 contributor B7228912.
- 94079149 contributor B7228913.
- 94079149 created "c1994.".
- 94079149 date "1994".
- 94079149 date "c1994.".
- 94079149 dateCopyrighted "c1994.".
- 94079149 description "Includes bibliographical references and indexes.".
- 94079149 description "v. 1. Design and process issues in electronic packaging / edited by William T. Shen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.".
- 94079149 extent "3 v. :".
- 94079149 identifier "0791814270 (v. 2)".
- 94079149 identifier "0791814424 (v. 3)".
- 94079149 identifier "0791814491 (v. 1)".
- 94079149 isPartOf "AMD (Series) ; v. 187, etc.".
- 94079149 isPartOf "AMD ; vol. 187, 193, 195 (v. 1)".
- 94079149 issued "1994".
- 94079149 issued "c1994.".
- 94079149 language "eng".
- 94079149 publisher "New York : American Society of Mechanical Engineers,".
- 94079149 subject "621.381/046 20".
- 94079149 subject "Electronic packaging Congresses.".
- 94079149 subject "Electronic packaging Materials Congresses.".
- 94079149 subject "TK7870.15 .M43 1994".
- 94079149 tableOfContents "v. 1. Design and process issues in electronic packaging / edited by William T. Shen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.".
- 94079149 title "Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / co-sponsored by the Applied Mechanics ... [et al.] Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME.".
- 94079149 type "text".