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- 95044649 contributor B7491856.
- 95044649 created "c1996.".
- 95044649 date "1996".
- 95044649 date "c1996.".
- 95044649 dateCopyrighted "c1996.".
- 95044649 description "Includes bibliographical references and index.".
- 95044649 extent "xxiv, 565 p. :".
- 95044649 identifier "0070366098".
- 95044649 identifier 95044649.html.
- 95044649 isPartOf "Electronic packaging and interconnection series".
- 95044649 issued "1996".
- 95044649 issued "c1996.".
- 95044649 language "eng".
- 95044649 publisher "Boston, Mass. : McGraw-Hill,".
- 95044649 subject "621.381/046 20".
- 95044649 subject "Flip chip technology.".
- 95044649 subject "Integrated circuits Very large scale integration Design and construction.".
- 95044649 subject "Multichip modules (Microelectronics) Design and construction.".
- 95044649 subject "TK7874 .F5897 1996".
- 95044649 title "Flip chip technologies / John H. Lau, editor.".
- 95044649 type "text".