Matches in Library of Congress for { <http://lccn.loc.gov/96031361> ?p ?o. }
Showing items 1 to 23 of
23
with 100 items per page.
- 96031361 contributor B7772032.
- 96031361 contributor B7772033.
- 96031361 created "c1997.".
- 96031361 date "1997".
- 96031361 date "c1997.".
- 96031361 dateCopyrighted "c1997.".
- 96031361 description "Includes bibliographical references and index.".
- 96031361 extent "xxi, 408 p. :".
- 96031361 identifier "0070366489 (hc : acid-free paper)".
- 96031361 identifier 96031361.html.
- 96031361 identifier 96031361.html.
- 96031361 isPartOf "Electronic packaging and interconnection series".
- 96031361 issued "1997".
- 96031361 issued "c1997.".
- 96031361 language "eng".
- 96031361 publisher "New York : McGraw-Hill,".
- 96031361 subject "621.381/046 20".
- 96031361 subject "Microelectronic packaging Reliability.".
- 96031361 subject "Multichip modules (Microelectronics) Testing.".
- 96031361 subject "Solder and soldering Testing.".
- 96031361 subject "TK7874 .L317 1997".
- 96031361 title "Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / John H. Lau, Yi-hsin Pao.".
- 96031361 type "text".