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- 96078690 contributor B7807583.
- 96078690 contributor B7807584.
- 96078690 contributor B7807585.
- 96078690 created "c1996.".
- 96078690 date "1996".
- 96078690 date "c1996.".
- 96078690 dateCopyrighted "c1996.".
- 96078690 description "Includes bibliographical references and index.".
- 96078690 extent "v, 125 p. :".
- 96078690 identifier "079181548X".
- 96078690 isPartOf "EEP (Series) ; vol. 17.".
- 96078690 isPartOf "EEP ; vol. 17".
- 96078690 issued "1996".
- 96078690 issued "c1996.".
- 96078690 language "eng".
- 96078690 publisher "New York, N.Y. : American Society of Mechanical Engineers,".
- 96078690 subject "621.381/046 21".
- 96078690 subject "Electronic packaging Congresses.".
- 96078690 subject "Multichip modules (Microelectronics) Congresses.".
- 96078690 subject "TK7870.15 .S45 1996".
- 96078690 title "Sensing, modeling, and simulation in emerging electronic packaging : presented at the 1996 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 1996, Atlanta, Georgia / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume.".
- 96078690 type "text".