Matches in Library of Congress for { <http://lccn.loc.gov/97019652> ?p ?o. }
Showing items 1 to 24 of
24
with 100 items per page.
- 97019652 contributor B8046437.
- 97019652 contributor B8046438.
- 97019652 created "c1997.".
- 97019652 date "1997".
- 97019652 date "c1997.".
- 97019652 dateCopyrighted "c1997.".
- 97019652 description "Includes bibliographical references and index.".
- 97019652 extent "xiv, 290 p. :".
- 97019652 identifier "0070326193 (recycled, acid-free paper)".
- 97019652 identifier 97019652.html.
- 97019652 identifier 97019652.html.
- 97019652 isPartOf "Electronic packaging and interconnection series".
- 97019652 issued "1997".
- 97019652 issued "c1997.".
- 97019652 language "eng".
- 97019652 publisher "New York : McGraw-Hill,".
- 97019652 subject "621.3815 21".
- 97019652 subject "Electronic packaging Defects.".
- 97019652 subject "Electronic packaging Reliability.".
- 97019652 subject "Semiconductors Failures.".
- 97019652 subject "TK7836 .H366 1997".
- 97019652 subject "Wire bonding (Electronic packaging) Production control.".
- 97019652 title "Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon.".
- 97019652 type "text".