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- 97227212 contributor B8240114.
- 97227212 contributor B8240115.
- 97227212 created "c1998.".
- 97227212 date "1998".
- 97227212 date "c1998.".
- 97227212 dateCopyrighted "c1998.".
- 97227212 description "Includes bibliographical references and index.".
- 97227212 extent "1 v. (various pagings) :".
- 97227212 identifier "0070228949 (acid-free paper)".
- 97227212 identifier 97227212.html.
- 97227212 identifier 97227212.html.
- 97227212 isPartOf "Electronic packaging and interconnection series".
- 97227212 issued "1998".
- 97227212 issued "c1998.".
- 97227212 language "eng".
- 97227212 publisher "New York : McGraw-Hill,".
- 97227212 subject "621.381 21".
- 97227212 subject "Integrated circuits Very large scale integration Design and construction.".
- 97227212 subject "Microelectronic packaging.".
- 97227212 subject "Multichip modules (Microelectronics)".
- 97227212 subject "TK7874 .G372 1998".
- 97227212 title "Multichip module technology handbook / Philip E. Garrou, Iwona Turlik.".
- 97227212 type "text".