Matches in Library of Congress for { <http://lccn.loc.gov/98053224> ?p ?o. }
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- 98053224 contributor B8377516.
- 98053224 contributor B8377517.
- 98053224 created "c1999.".
- 98053224 date "1999".
- 98053224 date "c1999.".
- 98053224 dateCopyrighted "c1999.".
- 98053224 description "Includes bibliographical references and index.".
- 98053224 extent "xxii, 564 p. :".
- 98053224 identifier "0070383049".
- 98053224 identifier 98053224-b.html.
- 98053224 identifier 98053224-d.html.
- 98053224 identifier 98053224.html.
- 98053224 issued "1999".
- 98053224 issued "c1999.".
- 98053224 language "eng".
- 98053224 publisher "New York : McGraw-Hill,".
- 98053224 subject "621.3815 21".
- 98053224 subject "Integrated circuits Design and construction.".
- 98053224 subject "Microelectronic packaging.".
- 98053224 subject "TK7874 .L3167 1999".
- 98053224 title "Chip scale package (CSP) : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.".
- 98053224 type "text".