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- 98074430 alternative "Characterization of evolving packaging materials and structures".
- 98074430 alternative "Evolving packaging materials and structures".
- 98074430 alternative "Packaging materials and structures".
- 98074430 contributor B8388627.
- 98074430 contributor B8388628.
- 98074430 contributor B8388629.
- 98074430 created "c1998.".
- 98074430 date "1998".
- 98074430 date "c1998.".
- 98074430 dateCopyrighted "c1998.".
- 98074430 description "Includes bibliographical references and author index.".
- 98074430 extent "v, 141 p. :".
- 98074430 identifier "0791815919".
- 98074430 isPartOf "EEP (Series) ; vol. 24.".
- 98074430 isPartOf "EEP ; vol. 24".
- 98074430 issued "1998".
- 98074430 issued "c1998.".
- 98074430 language "eng".
- 98074430 publisher "New York, N.Y. : American Society of Mechanical Engineers,".
- 98074430 subject "621.381/046 21".
- 98074430 subject "Deformations (Mechanics) Congresses.".
- 98074430 subject "Electronic packaging Materials Fatigue Congresses.".
- 98074430 subject "Electronic packaging Testing Congresses.".
- 98074430 subject "TK7870.15 .T483 1998".
- 98074430 subject "Thermal stresses Congresses.".
- 98074430 title "Characterization of evolving packaging materials and structures".
- 98074430 title "Evolving packaging materials and structures".
- 98074430 title "Packaging materials and structures".
- 98074430 title "Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh.".
- 98074430 type "text".