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- 98074670 contributor B8388838.
- 98074670 contributor B8388839.
- 98074670 created "1998.".
- 98074670 date "1998".
- 98074670 date "1998.".
- 98074670 dateCopyrighted "1998.".
- 98074670 description "Includes bibliographical references and index.".
- 98074670 extent "vii, 349 p. :".
- 98074670 identifier "0791818772 (pbk.)".
- 98074670 isPartOf "EEP (Series) ; vol. 25.".
- 98074670 isPartOf "EEP ; vol. 25".
- 98074670 issued "1998".
- 98074670 issued "1998.".
- 98074670 language "eng".
- 98074670 publisher "New York : American Society of Mechanical Engineers,".
- 98074670 subject "621.3815 21".
- 98074670 subject "Electronic packaging Materials Congresses.".
- 98074670 subject "Integrated circuits Reliability Congresses.".
- 98074670 subject "Polymeric composites Testing Congresses.".
- 98074670 subject "Polymers Mechanical properties Congresses.".
- 98074670 subject "TK7871.15.P6 W67 1998".
- 98074670 title "Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices : presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France / Ephraim Suhir, editor ; sponsored by the Electrical and Electronic Packaging Division, ASME ... [et al.].".
- 98074670 type "text".