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- 98084630 alternative "Multichip modules and high density packaging".
- 98084630 contributor B8390604.
- 98084630 contributor B8390605.
- 98084630 created "c1998.".
- 98084630 date "1998".
- 98084630 date "c1998.".
- 98084630 dateCopyrighted "c1998.".
- 98084630 description "Includes bibliographical references and index.".
- 98084630 extent "xi, 547 p. :".
- 98084630 identifier "0780348508 (softbound)".
- 98084630 identifier "0780348516 (microfiche)".
- 98084630 issued "1998".
- 98084630 issued "c1998.".
- 98084630 language "eng".
- 98084630 publisher "[New York] : Institute of Electrical and Electronics Engineers,".
- 98084630 subject "621.381/046 21".
- 98084630 subject "Microelectronic packaging Congresses.".
- 98084630 subject "Multichip modules (Microelectronics) Congresses.".
- 98084630 subject "TK7874 .I59433 1998".
- 98084630 title "Multichip modules and high density packaging".
- 98084630 title "Proceedings / 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, The Adam's Mark Hotel, Denver, Colorado ; sponsored by IMAPS ... [et al.].".
- 98084630 type "text".