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- 98158679 alternative "Semiconductor wafer bonding : science, technology, and applications".
- 98158679 contributor B8462030.
- 98158679 contributor B8462031.
- 98158679 contributor B8462032.
- 98158679 created "c1998.".
- 98158679 date "1998".
- 98158679 date "c1998.".
- 98158679 dateCopyrighted "c1998.".
- 98158679 description "Includes bibliographical references and indexes.".
- 98158679 extent "xi, 618 p. :".
- 98158679 identifier "1566771897".
- 98158679 isPartOf "Proceedings (Electrochemical Society) ; v. 97-36.".
- 98158679 isPartOf "Proceedings / Electrochemical Society ; v. 97-36".
- 98158679 issued "1998".
- 98158679 issued "c1998.".
- 98158679 language "eng".
- 98158679 publisher "Pennington, NJ : Electrochemical Society,".
- 98158679 subject "621.3815/2 21".
- 98158679 subject "Microelectromechanical systems Design and construction Congresses.".
- 98158679 subject "Semiconductor wafers Congresses.".
- 98158679 subject "Semiconductors Bonding Congresses.".
- 98158679 subject "TK7871.85 .I5838 1997".
- 98158679 title "Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications / editors, Ulrich Gösele ... [et al.] ; Electronics Division [of the Electrochemical Society].".
- 98158679 title "Semiconductor wafer bonding : science, technology, and applications".
- 98158679 type "text".