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- 98166447 contributor B8470641.
- 98166447 contributor B8470642.
- 98166447 contributor B8470643.
- 98166447 created "c1997.".
- 98166447 date "1997".
- 98166447 date "c1997.".
- 98166447 dateCopyrighted "c1997.".
- 98166447 description "Includes bibliographical references and index.".
- 98166447 extent "v, 109 p. :".
- 98166447 identifier "0791818527".
- 98166447 isPartOf "EEP (Series) ; vol. 23.".
- 98166447 isPartOf "EEP ; vol. 23".
- 98166447 isPartOf "HTD (Series) ; v. 356.".
- 98166447 isPartOf "HTD ; vol. 356".
- 98166447 issued "1997".
- 98166447 issued "c1997.".
- 98166447 language "eng".
- 98166447 publisher "New York : American Society of Mechanical Engineers,".
- 98166447 subject "621.381/046 21".
- 98166447 subject "Computer-aided engineering Congresses.".
- 98166447 subject "Electronic apparatus and appliances Temperature control Congresses.".
- 98166447 subject "Electronic packaging Design Data processing Congresses.".
- 98166447 subject "Heat Transmission Data processing Congresses.".
- 98166447 subject "Heat sinks (Electronics) Congresses.".
- 98166447 subject "TK7870.25 .C34 1997".
- 98166447 title "CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas / sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.].".
- 98166447 type "text".