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- 99013260 contributor B8632583.
- 99013260 created "c1999.".
- 99013260 date "1999".
- 99013260 date "c1999.".
- 99013260 dateCopyrighted "c1999.".
- 99013260 description "Includes bibliographical references and index.".
- 99013260 extent "xix, 134 p. :".
- 99013260 identifier "0792384857 (hb : alk. paper)".
- 99013260 identifier 99013260-d.html.
- 99013260 identifier 99013260-t.html.
- 99013260 issued "1999".
- 99013260 issued "c1999.".
- 99013260 language "eng".
- 99013260 publisher "Boston : Kluwer Academic Publishers,".
- 99013260 subject "621.381/046 21".
- 99013260 subject "Electronic apparatus and appliances Plastic embedment.".
- 99013260 subject "Integrated circuits Materials Stress corrosion.".
- 99013260 subject "Integrated circuits Materials Thermomechanical properties.".
- 99013260 subject "Microelectronic packaging.".
- 99013260 subject "TK7874 .K413 1999".
- 99013260 title "The simulation of thermomechanically induced stress in plastic encapsulated IC packages / Gerard Kelly.".
- 99013260 type "text".